2021 Scholarship Reception Booklet

Connecticut Chapter, Institute of Packaging Professionals Scholarship The Institute of Packaging Professionals (IoPP) is a national nonprofit professional association with headquarters in Chicago and chapters located throughout the United States. IoPP is dedicated to creating networking and educational opportunities that help packaging professionals succeed. The Connecticut Chapter, Institute of Packaging Professionals Scholarship was created to support a student planning a career in packaging and raise awareness of packaging as a career choice. This scholarship is awarded to a full-time sophomore, junior, or senior packaging major with a 3.0 or higher GPA. The annual awards are $1,000 each. Margaret Kendhammer Sarah Kusnier Ruth Kunz Conone Child and Family Studies Endowed Scholarship Ruth Kunz Conone, a 1969 UW-Stout graduate, has always enjoyed the field of education. After completing her doctorate and serving as a professor of education at several institutions, she became associate dean of extension at Ohio State University and assistant director for extension family living, retiring in 1998. This scholarship is awarded to a junior or senior early childhood major with financial need and a 3.0 or above GPA. The annual award is $750. Paityn Tiefs This scholarship aims to financially assist undergraduate students earning a B.S. in construction management or business management, or a M.S. in construction management, who will be entering the construction industry upon graduation. Construction Financial Management Association’s (CFMA) core purpose is to develop and support construction financial management professionals in meeting the ever changing challenges of the construction industry. CFMA’s core values are integrity, competency, leadership, innovation, friendship and member responsiveness. The annual award is $1,700. Joel Broberg Construction Financial Management Association Twin Cities Endowed Scholarship

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